Flip Chip and Advanced Packaging Technologies

Aimtron Foundation (www.aimtronfoundation.org) is organizing a series of Webinars, delivered by Industry Experts.

Webinar will cover introduction to Semiconductors, ESDM and development concepts and its processes – flip chip and advanced packaging technologies. How semiconductor chips are getting developed and manufactured with respect to different applications.

The Aim of this seminar is to guide and help students to understand industry’s need and what industry is looking from engineering students. This will help you to focus on domains that interests you – recent advancements in flip packaging technologies and new developments taking place in 2.5D and 3D packaging methods that are driving significant performance gains in GPUs, CPUs, FPGAs and other application specific processing units, concepts & processes.

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